Plasma Technology for Advanced Devices

CALL FOR PAPERS - 8th Technical and Scientific Meeting of CREMSI

Deadline for abstract submission : June 15, 2005

The 8th Technical and Scientific Meeting organized by CREMSI will take place on October 20th and 21st 2005 at STUniversity in Fuveau (France). It will be dedicated to "Front End Of Line : from 130 to 65 nm, scaling challenges". The focus will be done on FEOL, from substrate to pre-metal dielectric, and on the challenges for technologies from 130 nm to 65 nm. The topics of the call for papers include :

- Integration - process modules (substrate, device isolation, junctions, ONO, gate module, salicide, source-drain, advanced materials ...)

- Techniques for FEOL : process, equipment, chemicals and materials (lithography, mask technology, OPC, etch and strip, hot processes and deposition processes, ionic implant, measurement, characterisation...).

For more information please visit

Contacts :

Submission of abstracts and information:
Fax : +33 (4) 42 53 81 51
TÚl : +33 (4) 42 53 81 50

Technical information:
L. Jeannerot (ATMEL) :
J. Gilles (STMicroelectronics) :
I. Pages (CMP) :
B. Laborie (Kemesys) :
F. Fages (GCOM2) :

The CREMSI is an association in charge of strengthening and promoting the Microelectronics industry of the region of Provence Alpes Cote d'Azur. Its mission is to develop partnerships between the various players involved in Microelectronics.

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