Plasma Technology for Advanced Devices

7/30/2002
Advanced Micro Devices Inc., Infineon Technologies AG, and United Microelectronics Corp. (UMC) announce plans to collaborate on a “common” 300-mm, chip-manufacturing platform at the 65- and 45-nm technology nodes. Source: SBN

5/20/2003
UMCi, the joint venture between UMC and Infineon agreed to buy a lithography machine for 300-mm wafers from ASML, the AT:850B. Source: ""

8/6/2003
United Microelectronics Corp announces that it will buy out Infineon's share in UMCi Pte Ltd., the 300-mm wafer fab in Singapore. Source: SBN

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